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 Features
* Single Voltage Operation * * * * * * * * *
- 5V Read - 5V Reprogramming Fast Read Access Time - 90 ns Internal Program Control and Timer 16K bytes Boot Block With Lockout Fast Erase Cycle Time - 10 seconds Byte-By-Byte Programming - 10 s/Byte Typical Hardware Data Protection DATA Polling For End Of Program Detection Low Power Dissipation - 50 mA Active Current - 100 A CMOS Standby Current Typical 10,000 Write Cycles
Description
The AT49F080 is a 5-volt-only in-system Flash Memory device. Its 8-megabits of memory is organized as 1,024,576 words by 8-bits. Manufactured with Atmel's advanced nonvolatile CMOS technology, the device offers access times to 90 ns with power dissipation of just 275 mW over the commercial temperature range. When the device is deselected, the CMOS standby current is less than 100 A. The device contains a user-enabled "boot block" protection feature. Two versions of the feature are available: the AT49F080 locates the boot block at lowest order addresses ("bottom boot"); the AT49F080T locates it at highest order addresses ("top boot").
8-Megabit (1M x 8) 5-volt Only Flash Memory AT49F080 AT49F080T AT49F080/080T
Pin Configurations
Pin Name A0 - A19 CE OE WE RESET RDY/BUSY I/O0 - I/O7 NC Function Addresses Chip Enable Output Enable Write Enable Reset Ready/Busy Output Data Inputs/Outputs No Connect CBGA Top View
1 2 3 4 5 6 7
NC RESET A11 A10 A9 A8 A7 A6 A5 A4 NC NC A3 A2 A1 A0 I/O0 I/O1 I/O2 I/O3 GND GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
SOIC
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
(continued)
VCC CE A12 A13 A14 A15 A16 A17 A18 A19 NC NC NC NC WE OE RDY/BUSY I/O7 I/O6 I/O5 I/O4 VCC
TSOP Top VIew Type 1
A A5 B A4 C A6 D A3 I/O1 NC VCC I/O4 I/O7 NC E A2 F A1 I/O0 I/O2 GND I/O5 RY/BY WE A0 I/O3 GND I/O6 OE NC A9 RST CE A14 A16 A19 A7 A10 VCC A13 NC A18 A8 A11 NC A12 A15 A17
A19 A17 A15 A13 CE
A18 A16 A14 A12 4 6 8 10 12 14 16
1 3 5 7 9 11 13 15
2
40 38 36 34 32 30 28 26
39 37 35 33 31 29 27 25
NC OE I/O7 I/O5 VCC GND I/O2 I/O0 A1 A3
NC WE RDY/BUSY I/O6 I/O4 GND I/O3 I/O1 A0 A2
VCC NC RESET A11 A10 A9 A8 A7 A5 A6 A4
18 17 20 19
24 23 22 21
0584B-A-8/97
1
To allow for simple in-system reprogrammability, the AT49F080 does not require high input voltages for programming. 5-volt-only commands determine the read and programming operation of the device. Reading data out of the device is similar to reading from an EPROM. Reprogramming the AT49F080 is performed by erasing the entire 8 megabits of memory and then programming on a byte-bybyte basis. The typical byte programming time is a fast 10 s. The end of a program cycle can be optionally detected by the DATA polling feature. Once the end of a byte pro-
gram cycle has been detected, a new access for a read or program can begin. The typical number of program and erase cycles is in excess of 10,000 cycles The optional 16K bytes boot block section includes a reprogramming write lock out feature to provide data integrity. The boot sector is designed to contain user secure code, and when the feature is enabled, the boot sector is permanently protected from being reprogrammed.
Block Diagram
AT49F080 DATA INPUTS/OUTPUTS I/O7 - I/O0 8 OE, CE, AND WE LOGIC DATA LATCH INPUT/OUTPUT BUFFERS Y-GATING FFFFFH X DECODER MAIN MEMORY (1008K BYTES) 03FFFH OPTIONAL BOOT BLOCK (16K BYTES) 00000H MAIN MEMORY (1008K BYTES) 00000H OPTIONAL BOOT BLOCK (16K BYTES) FC000H AT49F080T DATA INPUTS/OUTPUTS I/O7 - I/O0 8 DATA LATCH INPUT/OUTPUT BUFFERS Y-GATING FFFFFH
VCC GND OE WE CE
Y DECODER ADDRESS INPUTS
Device Operation
READ: The AT49F080 is accessed like an EPROM. When CE and OE are low and WE is high, the data stored at the memory location determined by the address pins is asserted on the outputs. The outputs are put in the high impedance state whenever CE or OE is high. This dualline control gives designers flexibility in preventing bus contention. ERASURE: Before a byte can be reprogrammed, the 1024K bytes memory array (or 1008K bytes if the boot block featured is used) must be erased. The erased state of the memory bits is a logical "1". The entire device can be erased at one time by using a 6-byte software code. The software chip erase code consists of 6-byte load commands to specific address locations with a specific data pattern (please refer to the Chip Erase Cycle Waveforms). After the software chip erase has been initiated, the device will internally time the erase operation so that no external clocks are required. The maximum time needed to erase the whole chip is tEC. If the boot block lockout feature has been enabled, the data in the boot sector will not be erased. BYTE PROGRAMMING: Once the memory array is erased, the device is programmed (to a logical "0") on a 2 byte-by-byte basis. Please note that a data "0" cannot be programmed back to a "1"; only erase operations can convert "0"s to "1"s. Programming is accomplished via the internal device command register and is a 4 bus cycle operation (please refer to the Command Definitions table). The device will automatically generate the required internal program pulses. The program cycle has addresses latched on the falling edge of WE or CE, whichever occurs last, and the data latched on the rising edge of WE or CE, whichever occurs first. Programming is completed after the specified t BP cycle time. The DATA polling feature may also be used to indicate the end of a program cycle. BOOT BLOCK PROGRAMMING LOCKOUT: The device has one designated block that has a programming lockout feature. This feature prevents programming of data in the designated block once the feature has been enabled. The size of the block is 16K bytes. This block, referred to as the boot block, can contain secure code that is used to bring up the system. Enabling the lockout feature will allow the boot code to stay in the device while data in the rest of the device is updated. This feature does not have to be activated; the boot block's usage as a write protected region is
AT49F080/080T
AT49F080/080T
optional to the user. The address range of the AT49F080 boot block is 00000H to 03FFFH while the address range of the AT49F080T boot block is FC000H to FFFFFH. To activate the lockout feature, a series of six program commands to specific addresses with specific data must be performed. Please refer to the Command Definitions table. BOOT BLOCK LOCKOUT DETECTION: A software method is available to determine if programming of the boot block section is locked out. When the device is in the software product identification mode (see Software Product Identification Entry and Exit sections) a read from address location 00002H will show if programming the boot block is locked out. If the data on I/O0 is low, the boot block can be programmed; if the data on I/O0 is high, the program lockout feature has been activated and the block cannot be programmed. The software product identification exit code should be used to return to standard operation. BOOT BLOCK PROGRAMMING LOCKOUT OVERRIDE: The user can override the boot block programming lockout by taking the RESET pin to 12V 0.5V. By doing this, protected boot block data can be altered through a chip erase, or byte programming. When the RESET pin is brought back to TTL levels, the boot block programming lockout feature is again active. PRODUCT IDENTIFICATION: The product identification mode identifies the device and manufacturer as Atmel. It may be accessed by hardware or software operation. The hardware operation mode can be used by an external programmer to identify the correct programming algorithm for the Atmel product. For details, see Operating Modes (for hardware operation) or Software Product Identification. The manufacturer and device code is the same for both modes. DATA POLLING: The AT49F080 features DATA polling to indicate the end of a program cycle. During a program cycle an attempted read of the last byte loaded will result in the complement of the loaded data on I/O7. Once the program cycle has been completed, true data is valid on all outputs and the next cycle may begin. DATA polling may begin at any time during the program cycle. TOGGLE BIT: In addition to DATA polling, the AT49F080 provides another method for determining the end of a program or erase cycle. During a program or erase operation, successive attempts to read data from the device will result in I/O6 toggling between one and zero. Once the program cycle has completed, I/O6 will stop toggling and valid data will be read. Examining the toggle bit may begin at any time during a program cycle. RDY/BUSY: An open drain READY/BUSY output pin provides another method of detecting the end of a program or erase operation. RDY/BUSY is actively pulled low during the internal program and erase cycles and is released at the completion of the cycle. The open drain connection allows for OR - tying of several devices to the same RDY/BUSY line. RESET: A RESET input pin is provided to ease some system applications. When RESET is at a logic high level, the device is in its standard operating mode. A low level on the RESET input halts the present device operation and puts the outputs of the device in a high impedance state. If the RESET pin makes a high to low transition during a program or erase operation, the operation may not be successfully completed and the operation will have to be repeated after a high level is applied to the RESET pin. When a high level is reasserted on the RESET pin, the device returns to the read or standby mode, depending upon the state of the control inputs. By applying a 12V 0.5V input signal to the RESET pin, the boot block array can be reprogrammed even if the boot block lockout feature has been enabled (see Boot Block Programming Lockout Override section). HARDWARE DATA PROTECTION: Hardware features protect against inadvertent programs to the AT49F080 in the following ways: (a) V CC sense: if VCC is below 3.8V (typical), the program function is inhibited. (b) Program inhibit: holding any one of OE low, CE high or WE high inhibits program cycles. (c) Noise filter: pulses of less than 15 ns (typical) on the WE or CE inputs will not initiate a program cycle.
3
Command Definition (in Hex)
Command Sequence Read Chip Erase Byte Program Boot Block Lockout(1) Bus Cycles 1 6 4 6 3 3 1st Bus Cycle Addr Addr 5555 5555 5555 5555 5555 Data DOUT AA AA AA AA AA 2AAA 2AAA 2AAA 2AAA 2AAA 55 55 55 55 55 5555 5555 5555 5555 5555 80 A0 80 90 F0 5555 Addr 5555 AA DIN AA 2AAA 55 5555 40 2AAA 55 5555 10 2nd Bus Cycle Addr Data 3rd Bus Cycle Addr Data 4th Bus Cycle Addr Data 5th Bus Cycle Addr Data 6th Bus Cycle Addr Data
Product ID Entry Product ID Exit(2) Exit(2)
Product ID 1 XXXX F0 Notes: 1. The 16K byte boot sector has the address range 00000H to 03FFFH for the AT49F080 and FC000H to FFFFFH for the AT49F080T. 2. Either one of the Product ID Exit commands can be used.
Absolute Maximum Ratings*
Temperature Under Bias................................ -55C to +125C Storage Temperature ..................................... -65C to +150C All Input Voltages (including NC Pins) with Respect to Ground ...................................-0.6V to +6.25V All Output Voltages with Respect to Ground ............................ -0.6V to VCC + 0.6V Voltage on OE with Respect to Ground ...................................-0.6V to +13.5V *NOTICE: Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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AT49F080/080T
AT49F080/080T
DC and AC Operating Range
AT49F080-90 Operating Temperature (Case) VCC Power Supply Com. Ind. 0C - 70C -40C - 85C 5V 10% AT49F080-12 0C - 70C -40C - 85C 5V 10% AT49F080-15 0C - 70C -40C - 85C 5V 10%
Operating Modes
Mode Read Program
(2)
CE VIL VIL VIH X X X X
OE VIL VIH X(1) X VIL VIH X
WE VIH VIL X VIH X X X
RESET VIH VIH VIH VIH VIH VIH VIL
Ai Ai Ai X
I/O DOUT DIN High Z
RDY/BUSY VOH VOL VOH VOH VOH
Standby/Write Inhibit Program Inhibit Program Inhibit Output Disable RESET Product Identification
High Z X High Z
VOH
VIL Hardware
VIL
VIH
VIH
A1 - A19 = VIL, A9 = VH,(3) A0 = VIL A1 - A19 = VIL, A9 = VH,(3) A0 = VIH A0 = VIL, A1 - A19 = VIL A0 = VIH, A1 - A19 = VIL
Manufacturer Code(4) Device Code(4) Manufacturer Code(4) Device Code(4)
Software(5)
Notes:
1. X can be VIL or VIH. 2. Refer to AC Programming Waveforms. 3. VH = 12.0V 0.5V 4. Manufacturer Code: 1FH Device Code: 23H (AT49F080), 27H (AT49F080T) 5. See details under Software Product Identification Entry/Exit..
DC Characteristics
Symbol ILI ILO ISB1 ISB2 ICC(1) VIL VIH VOL VOH1 VOH2 Parameter Input Load Current Output Leakage Current VCC Standby Current CMOS VCC Standby Current TTL VCC Active Current Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage Output High Voltage CMOS IOL = 2.1 mA IOH = -400 A IOH = -100 A; VCC = 4.5V 2.4 4.2 2.0 0.45 Condition VIN = 0V to VCC VI/O = 0V to VCC Com. CE = VCC - 0.3V to VCC CE = 2.0V to VCC f = 5 MHz; IOUT = 0 mA Ind. Min Max 10 10 100 300 3 50 0.8 Units A A A A mA mA V V V V V
Note:
1. ICC in the erase mode is 90 mA.
5
AC Read Characteristics
AT49F080-90 Symbol tACC tCE(1) tOE(2) tDF(3)(4) tOH Parameter Address to Output Delay CE to Output Delay OE to Output Delay CE or OE to Output Float Output Hold from OE, CE or Address, whichever occurred first 0 0 0 Min Max 90 90 40 25 0 0 0 AT49F080-12 Min Max 120 120 50 30 0 0 0 AT49F080-15 Min Max 150 150 70 40 Units ns ns ns ns ns
AC Read Waveforms
ADDRESS CE tCE tOE tDF tACC OUTPUT HIGH Z tOH OUTPUT VALID ADDRESS VALID
OE
Notes:
1. 2. 3. 4.
CE may be delayed up to tACC - tCE after the address transition without impact on tACC. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE or by tACC - tOE after an address change without impact on t ACC. tDF is specified from OE or CE whichever occurs first (CL = 5 pF). This parameter is characterized and is not 100% tested
Input Test Waveforms and Measurement level
3.0V AC DRIVING LEVELS 0.0V 1.5V AC MEASUREMENT LEVEL
Output Test Load
5.0V
1.8K OUTPUT PIN 1.3K 100 pF
tR, tF < 5 ns
Pin Capacitance
(f = 1 MHz, T = 25 C)
Typ CIN COUT Note: 4 8 Max 6 12 Units pF pF Conditions VIN = 0V VOUT = 0V
1. This parameter is characterized and is not 100% tested
6
AT49F080/080T
AT49F080/080T
AC Byte Load Characteristics
Symbol tAS, tOES tAH tCS tCH tWP tDS tDH, tOEH tWPH Parameter Address, OE Set-up Time Address Hold Time Chip Select Set-up Time Chip Select Hold Time Write Pulse Width (WE or CE) Data Set-up Time Data, OE Hold Time Write Pulse Width High Min 0 50 0 0 90 50 0 90 Max Units ns ns ns ns ns ns ns ns
AC Byte Load Waveforms
WE Controlled
OE tOES ADDRESS tAS CE tCS WE tWP tDS DATA IN tWPH tDH tAH tCH tOEH
CE Controlled
OE tOES ADDRESS tAS WE tCS CE tWP tDS DATA IN tWPH tDH tAH tCH tOEH
7
Program Cycle Characteristics
Symbol tBP tAS tAH tDS tDH tWP tWPH tEC Parameter Byte Programming Time Address Set-up Time Address Hold Time Data Set-up Time Data Hold Time Write Pulse Width Write Pulse Width High Erase Cycle Time 0 50 50 0 90 90 10 Min Typ 10 Max 50 Units s ns ns ns ns ns ns seconds
Program Cycle Waveforms
PROGRAM CYCLE OE
CE tWP WE tAS A0-A19 5555 tDS DATA AA 55 A0
INPUT DATA
tWPH
tBP
tAH 2AAA
tDH 5555 ADDRESS
Chip Erase Cycle Waveforms
OE
CE tWP WE tAS A0-A19 5555 tDS DATA AA BYTE 0 55 BYTE 1 80 BYTE 2 AA BYTE 3 55 BYTE 4 10 BYTE 5 tAH 2AAA tDH 5555 5555 2AAA 5555 tEC tWPH
Note:
OE must be high only when WE and CE are both low.
8
AT49F080/080T
AT49F080/080T
Data Polling Characteristics(1)
Symbol tDH tOEH tOE tWR Parameter Data Hold Time OE Hold Time OE to Output Delay
(2)
Min 10 10
Typ
Max
Units ns ns ns
Write Recovery Time
0
ns
Notes:
1. These parameters are characterized and not 100% tested 2. See tOE spec in AC Read Characteristics.
Data Polling Waveforms
WE
CE tOEH OE tDH I/O7 tOE HIGH Z tWR
A0-A19
An
An
An
An
An
Toggle Bit Characteristics(1)
Symbol tDH tOEH tOE tOEHP tWR Parameter Data Hold Time OE Hold Time OE to Output Delay OE High Pulse Write Recovery Time
(2)
Min 10 10
Typ
Max
Units ns ns ns
150 0
ns ns
Notes:
1. These parameters are characterized and not 100% tested. 2. See tOE spec in AC Read Characteristics.
Toggle Bit Waveforms(1)(2)(3)
WE
CE tOEH OE tDH I/O6 tOE HIGH Z tWR tOEHP
Notes:
1. 2. 3.
Toggling either OE or CE or both OE and CE will operate toggle bit. The tOEHP specification must be met by the toggling input(s). Beginning and ending state of I/O6 will vary. Any address location may be used but the address should not vary.
9
Software Product Identification Entry(1)
LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA 90 TO ADDRESS 5555 ENTER PRODUCT IDENTIFICATION MODE(2)(3)(5)
Boot Block Lockout Feature Enable Algorithm(1)
LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA 80 TO ADDRESS 5555 LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA 40 TO ADDRESS 5555
Software Product Identification Exit(1)
LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA F0 TO ADDRESS 5555 EXIT PRODUCT IDENTIFICATION MODE(4)
OR
LOAD DATA F0 TO ANY ADDRESS EXIT PRODUCT IDENTIFICATION MODE(4)
PAUSE 1 second(2)
Notes:
1. 2.
Data Format: I/07 - I/O0 (Hex); Address Format: A14 - A0 (Hex). Boot block lockout feature enabled.
Notes:
1. 2.
Data Format: I/O7 - I/O0 (Hex); Address Format: A14 - A0 (Hex). A1 - A19 = VIL. Manufacture Code is read for A0 = VIL; Device Code is read for A0 = VIH. The device does not remain in identification mode if powered down. The device returns to standard operation mode. Manufacturers Code: 1FH Device Code: 23H (AT49F080), 27H (AT49F080T)
3. 4. 5.
10
AT49F080/080T
AT49F080/080T
Ordering Information
tACC (ns) 90 ICC (mA) Active 50 Standby 0.1 Ordering Code AT49F080-90CC AT49F080-90RC AT49F080-90TC AT49F080-90CI AT49F080-90RI AT49F080-90TI AT49F080-12CC AT49F080-12RC AT49F080-12TC AT49F080-12CI AT49F080-12RI AT49F080-12TI AT49F080-15CC AT49F080-15RC AT49F080-15TC AT49F080-15TI AT49F080-15TI AT49F080-15TI Package 42C2 44R 40T 42C2 44R 40T 42C2 44R 40T 42C2 44R 40T 42C2 44R 40T 42C2 44R 40T Operation Range Commercial (0 to 70C) Industrial (-40 to 85C) Commercial (0 to 70C) Industrial (-40 to 85C) Commercial (0 to 70C) Industrial (-40 to 85C)
50
0.3
120
50
0.1
50
0.3
150
50
0.1
50
0.3
(continued)
Pakage Type 42C2 44R 40T 42-Ball, Plastic Chip-Size Ball Grid Array Package (CBGA) 8 x 14 mm 44-Lead, 0.525" Wide, Plastic Gull Wing Small Outline Package (SOIC/SOP) 40-Lead, Thin Small Outline Package (TSOP)
11
Ordering Information
tACC (ns) 90 ICC (mA) Active 50 Standby 0.1 Ordering Code AT49F080T-90CC AT49F080T-90RC AT49F080T-90TC AT49F080T-90CI AT49F080T-90RI AT49F080T-90TI AT49F080T-12CC AT49F080T-12RC AT49F080T-12TC AT49F080T-12CI AT49F080T-12RI AT49F080T-12TI AT49F080T-15CC AT49F080T-15RC AT49F080T-15TC AT49F080T-15CI AT49F080T-15RI AT49F080T-15TI Package 42C2 44R 40T 42C2 44R 40T 42C2 44R 40T 42C2 44R 40T 42C2 44R 40T 42C2 44R 40T Operation Range Commercial (0 to 70C) Industrial (-40 to 85C) Commercial (0 to 70C) Industrial (-40 to 85C) Commercial (0 to 70C) Industrial (-40 to 85C)
50
0.3
120
50
0.1
50
0.3
150
50
0.1
50
0.3
Pakage Type 42C2 44R 40T 42-Ball, Plastic Chip-Size Ball Grid Array Package (CBGA) 8 x 14 mm 44-Lead, 0.525" Wide, Plastic Gull Wing Small Outline Package (SOIC/SOP) 40-Lead, Thin Small Outline Package (TSOP)
12
AT49F080/080T


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